Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TO-252 |
|
Dimensions/Packaging: | TO-252 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube, Rail |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC33269DT-3.3G
|
Motorola | 类似代替 |
LDO(低压降)线性电压调节器,On Semiconductor,550mA 至 800mA
|
|||
MC33269DT-3.3G
|
ON Semiconductor | 类似代替 | TO-252-3 |
LDO(低压降)线性电压调节器,On Semiconductor,550mA 至 800mA
|
||
MC33269DTRK-3.3G
|
Rochester | 类似代替 | DPAK |
ON SEMICONDUCTOR MC33269DTRK-3.3G. 芯片, 稳压器, LDO, 3.3V, 0.8A, D-PAK-3, 整卷
|
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