Technical parameters/number of output interfaces: | 6 |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | LQFP-48 |
|
Dimensions/Packaging: | LQFP-48 |
|
Physical parameters/operating temperature: | -40℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC33907AER2
|
NXP | 完全替代 | LQFP-48 |
System Basis Chip, CAN/LIN, 1.2 or 3.3V/800mA VCORE buck, 3.3 or 5V/800mA VIO, QFP 48, Reel
|
||
MC33907AER2
|
Freescale | 完全替代 | LQFP-48 |
System Basis Chip, CAN/LIN, 1.2 or 3.3V/800mA VCORE buck, 3.3 or 5V/800mA VIO, QFP 48, Reel
|
||
MC33907NAE
|
Freescale | 完全替代 | LQFP-48 |
系统基础芯片, CAN, LIN协议, ISO 11898-2/5, LIN 1.3/2.0/2.1/2.2, SAE J2602, HLQFP-48
|
||
MC33907NAE
|
NXP | 完全替代 | LQFP-48 |
系统基础芯片, CAN, LIN协议, ISO 11898-2/5, LIN 1.3/2.0/2.1/2.2, SAE J2602, HLQFP-48
|
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