Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Rail |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 类似代替 | DIP |
八路透明锁存器具有三态输出 Octal Transparent Latch with 3-STATE Outputs
|
||
|
|
ON Semiconductor | 类似代替 | DIP-20 |
八路透明锁存器具有三态输出 Octal Transparent Latch with 3-STATE Outputs
|
||
74ACTQ373PC
|
Fairchild | 类似代替 | DIP-20 |
8位D类锁存器 8-Bit D-Type Latch
|
||
74ACTQ373PC
|
ON Semiconductor | 类似代替 | DIP-20 |
8位D类锁存器 8-Bit D-Type Latch
|
||
MC74ACT373NG
|
ON Semiconductor | 完全替代 | DIP-20 |
八路透明锁存器具有三态输出 Octal Transparent Latch with 3−State Outputs
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review