Technical parameters/frequency: | 40 MHz |
|
Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/RAM size: | 512 x 8 |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Rail, Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC9S08SH8CPJ
|
NXP | 功能相似 | DIP-20 |
NXP MC9S08SH8CPJ 微控制器, 8位, 通用 SH系列, S08SH, 40 MHz, 8 KB, 512 Byte, 20 引脚, DIP
|
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