Chip AI consultant
Technical parameters/rise/fall time: | 1.3µs, 16µs |
| |||||
Technical parameters/Input voltage (DC): | 1.25 V |
| |||||
Technical parameters/output voltage: | ≤30.0 V |
| |||||
Technical parameters/number of circuits: | 1 |
| |||||
Technical parameters/number of channels: | 1 |
| |||||
Technical parameters/forward voltage: | 1.25 V |
| |||||
Technical parameters/input current: | 5.00 mA |
| |||||
Technical parameters/dissipated power: | 260 mW |
| |||||
Technical parameters/rise time: | 1.3 µs |
| |||||
Technical parameters/isolation voltage: | 5300 Vrms |
| |||||
Technical parameters/forward current: | 50 mA |
| |||||
Technical parameters/output voltage (Max): | 30 V |
| |||||
Technical parameters/forward voltage (Max): | 1.5 V |
| |||||
Technical parameters/forward current (Max): | 50 mA |
| |||||
Technical parameters/descent time: | 16 µs |
| |||||
Technical parameters/descent time (Max): | 30 µs |
| |||||
Technical parameters/rise time (Max): | 6 µs |
| |||||
Technical parameters/operating temperature (Max): | 100 ℃ |
| |||||
Technical parameters/operating temperature (Min): | -55 ℃ |
| |||||
Technical parameters/dissipated power (Max): | 260 mW |
| |||||
Encapsulation parameters/installation method: | Through Hole |
| |||||
Package parameters/number of pins: | 6 |
| |||||
Encapsulation parameters/Encapsulation: | DIP-6 |
| |||||
Dimensions/Packaging: | DIP-6 |
| |||||
Physical parameters/operating temperature: | -55℃ ~ 100℃ |
| |||||
Other/Product Lifecycle: | Unknown |
| |||||
Other/Packaging Methods: | Bulk |
| |||||
Compliant with standards/RoHS standards: | RoHS Compliant |
| |||||
Compliant with standards/lead standards: | Lead Free |
| |||||
Customs informati Alternative material
Newly listed productsVideo playback©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd. |
The most helpful review