Technical parameters/Contact electroplating: | Gold |
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Technical parameters/Insulation resistance: | 1000 MΩ |
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Technical parameters/Contact resistance: | 5.00 mΩ |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Dimensions/Height: | 8.2 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/insulation material: | Teflon |
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Physical parameters/operating temperature: | -65℃ ~ 125℃ |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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