Encapsulation parameters/Encapsulation: | ZIP |
|
Dimensions/Packaging: | ZIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube, Rail |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8177F
|
ST Microelectronics | 功能相似 | ZIP |
垂直偏转助推器 VERTICAL DEFLECTION BOOSTER
|
||
TDA9302H
|
ST Microelectronics | 功能相似 | - |
垂直偏转输出电路 VERTICAL DEFLECTION OUTPUT CIRCUIT
|
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