TLV2770CDR In Stock|PDF|Datasheet|Price|Agent[TLV2770CDR Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

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Model TLV2770CDR

Description 家庭2.7 -V高转换率轨至轨输出运算放大器，带有关断 FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

Brand: TI

Packaging SOIC-8

Delivery time

Packaging method Tape & Reel (TR)

Standard packaging quantity 1

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Technical parameters/power supply current:	1 mA
Technical parameters/number of circuits:	1
Technical parameters/number of channels:	1
Technical parameters/dissipated power:	725 mW
Technical parameters/input compensation drift:	2.00 µV/K
Technical parameters/bandwidth:	5.10 MHz
Technical parameters/conversion rate:	10.5 V/μs
Technical parameters/gain bandwidth product:	5.1 MHz
Technical parameters/Over temperature protection:	No
Technical parameters/input compensation voltage:	500 µV
Technical parameters/input bias current:	2 pA
Technical parameters/operating temperature (Max):	125 ℃
Technical parameters/operating temperature (Min):	-40 ℃
Technical parameters/gain bandwidth:	5.1 MHz
Technical parameters/dissipated power (Max):	725 mW
Technical parameters/Common Mode Rejection Ratio (Min):	70 dB
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	8
Encapsulation parameters/Encapsulation:	SOIC-8
Dimensions/Length:	4.9 mm
Dimensions/Width:	3.91 mm
Dimensions/Height:	1.58 mm
Dimensions/Packaging:	SOIC-8
Physical parameters/operating temperature:	0℃ ~ 70℃
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape & Reel (TR)
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free