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Description MLP 系列扁平封装 高能量存储和盒形使此系列特别适用于军事 SEM-E 模块、电信电路包和计算机卡中的电压保持或过滤。 1/2” 高度时,MLP 提供高达 20 焦耳的能量存储,温度为 +45 ºC 时寿命为 50 年 薄型替代品,用于咬接式电容器 安装在散热器上时,波纹容量翻倍 几乎密封的焊接可确保 50 年使用寿命 可耐受 80,000 多次支脚海拔 ### 径向,85°C
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Packaging method Bulk
Standard packaging quantity 1
819.79  yuan 819.79yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(8505) Minimum order quantity(1)
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Technical parameters/rated voltage (DC):

35.0 V

 

Technical parameters/capacitance:

14000 µF

 

Technical parameters/Equivalent series resistance (ESR):

35.0 mΩ

 

Technical parameters/tolerances:

±20 %

 

Technical parameters/product series:

MLP

 

Technical parameters/Ripple current:

9.6 A

 

Technical parameters/operating temperature (Max):

85 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Technical parameters/rated voltage:

35 V

 

Encapsulation parameters/installation method:

Through Hole

 

Encapsulation parameters/Encapsulation:

-

 

Packaging parameters/pin spacing:

25.4 mm

 

Dimensions/Length:

76.2 mm

 

Dimensions/Width:

44.5 mm

 

Dimensions/Height:

76.2 mm

 

Dimensions/Packaging:

-

 

Dimensions/Pin Spacing:

25.4 mm

 

Physical parameters/medium materials:

Aluminum Electrolytic

 

Physical parameters/operating temperature:

-55℃ ~ 85℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Bulk

 

Other/Lifespan (hours):

2000h @85℃

 

Other/Manufacturing Applications:

General

 

Compliant with standards/RoHS standards:

Non-Compliant

 

Compliant with standards/lead standards:

Contains Lead

 

Compliant with standard/REACH SVHC version:

2015/12/17

 

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