Chip AI consultant
Technical parameters/frequency: | 1 MHz |
| ||||||
Technical parameters/number of output interfaces: | 3 |
| ||||||
Technical parameters/Input voltage (DC): | 5.00V ~ 37.0V |
| ||||||
Technical parameters/output voltage: | 40 V |
| ||||||
Technical parameters/output current: | 200 mA |
| ||||||
Technical parameters/dissipated power: | 3100 mW |
| ||||||
Technical parameters/Static current: | 4.00 mA |
| ||||||
Technical parameters/adjusted output: | 3 |
| ||||||
Technical parameters/switching frequency: | 1 MHz |
| ||||||
Technical parameters/Over temperature protection: | Yes |
| ||||||
Technical parameters/topology structure: | Boost |
| ||||||
Technical parameters/Input voltage (Max): | 37 V |
| ||||||
Technical parameters/input voltage (Min): | 5 V |
| ||||||
Technical parameters/operating temperature (Max): | 125 ℃ |
| ||||||
Technical parameters/operating temperature (Min): | -40 ℃ |
| ||||||
Technical parameters/dissipated power (Max): | 3100 mW |
| ||||||
Technical parameters/power supply voltage: | 4.5V ~ 36V |
| ||||||
Technical parameters/input voltage: | 5V ~ 36V |
| ||||||
Encapsulation parameters/installation method: | Surface Mount |
| ||||||
Package parameters/number of pins: | 28 |
| ||||||
Encapsulation parameters/Encapsulation: | HTSSOP-28 |
| ||||||
Dimensions/Length: | 9.7 mm |
| ||||||
Dimensions/Width: | 4.4 mm |
| ||||||
Dimensions/Height: | 0.9 mm |
| ||||||
Dimensions/Packaging: | HTSSOP-28 |
| ||||||
Physical parameters/operating temperature: | -40℃ ~ 125℃ (TJ) |
| ||||||
Other/Product Lifecycle: | Active |
| ||||||
Other/Packaging Methods: | Tube |
| ||||||
Other/Manufacturing Applications: | backlight |
| ||||||
Compliant with standards/RoHS standards: | RoH Alternative material
Newly listed productsVideo playback©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd. |
The most helpful review