Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | microSMD-8 |
|
Dimensions/Packaging: | microSMD-8 |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM3501TLX-21/NOPB
|
TI | 类似代替 | WFBGA-8 |
开关控制器 R 595-TPS61165DRVR
|
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