Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC |
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Dimensions/Packaging: | SOIC |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM385BM-2.5/NOPB
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TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS LM385BM-2.5/NOPB 电压基准, 微功率, 分流 - 固定, LM385系列, 2.5V, SOIC-8
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LM385M-2.5/NOPB
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National Semiconductor | 功能相似 | SOIC-8 |
2.4V 至 2.5V ### 电压参考,Texas Instruments 精密固定和可调电压参考 IC 利用串联、并联或串联/并联拓扑,并提供通孔和表面安装封装。 电压参考的初始准确度为 ±0.02 至 ±2%。
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