Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | MSOP |
|
Dimensions/Packaging: | MSOP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM555CMM
|
TI | 功能相似 | VSSOP-8 |
从微秒至小时计时 Timing from Microseconds through Hours
|
||
LM555CMM/NOPB
|
TI | 功能相似 | MSOP-8 |
TEXAS INSTRUMENTS LM555CMM/NOPB 芯片, 定时器, 可编程, 15mA, 8MSOP
|
||
LM555CMMX/NOPB
|
TI | 功能相似 | VSSOP-8 |
从微秒至小时计时 Timing from Microseconds through Hours
|
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