Technical parameters/access time (Max): | 10 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 2.7V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | DFN-8 |
|
Dimensions/Packaging: | DFN-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
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Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MR25H256CDC
|
Everspin Technologies | 完全替代 | DFN-8 |
MR25H256 系列 256 kB 32 K x 8 3 V 串行 SPI 表面贴装 MRAM - DFN-8
|
||
MR25H256MDC
|
Everspin Technologies | 类似代替 | DFN-8 |
MR25H256 系列 256K (32K x 8) 3.6 V 表面贴装 串行 SPI MRAM - DFN-8
|
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