LE25U40CMDTWG In Stock|PDF|Datasheet|Price|Agent[LE25U40CMDTWG Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

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Model LE25U40CMDTWG

Description 4Mb(512K x 8),串行Flash存储器

Brand: ON Semiconductor

Packaging SOIC-8

Delivery time

Packaging method Cut Tape (CT)

Standard packaging quantity 1

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Technical parameters/power supply voltage (DC):	2.30V (min)
Technical parameters/power supply current:	12 mA
Technical parameters/number of pins:	8
Technical parameters/clock frequency:	40 MHz
Technical parameters/digits:	8
Technical parameters/access time:	11 ns
Technical parameters/memory capacity:	500000 B
Technical parameters/access time (Max):	11 ns
Technical parameters/operating temperature (Max):	85 ℃
Technical parameters/operating temperature (Min):	-40 ℃
Technical parameters/power supply voltage:	2.3V ~ 3.6V
Technical parameters/power supply voltage (Max):	3.6 V
Technical parameters/power supply voltage (Min):	2.3 V
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	8
Encapsulation parameters/Encapsulation:	SOIC-8
Dimensions/Length:	5 mm
Dimensions/Width:	4 mm
Dimensions/Height:	1.5 mm
Dimensions/Packaging:	SOIC-8
Physical parameters/operating temperature:	-40℃ ~ 85℃ (TA)
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Cut Tape (CT)
Other/Manufacturing Applications:	Portable equipment, SPI Bus Flash Memory Devices, Embedded Design& Development, Embedded Design & Development,
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	lead-free
Compliant with standard/REACH SVHC version:	2015/12/17
Customs information/ECCN code:	EAR99