Technical parameters/number of circuits: | 1 |
|
Technical parameters/dissipated power: | 1000 mW |
|
Technical parameters/dissipated power (Max): | 1000 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 28 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape, Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX306EWI+T
|
Maxim Integrated | 完全替代 | SOIC-28 |
MAXIM INTEGRATED PRODUCTS MAX306EWI+T 芯片, 模拟多路复用器, 单路, 16:1, WSOIC-28
|
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