Technical parameters/dissipated power: | 471 mW |
|
Technical parameters/Common Mode Rejection Ratio: | 56.48 dB |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX965ESA+
|
Maxim Integrated | 完全替代 | SOIC-8 |
MAXIM INTEGRATED PRODUCTS MAX965ESA+ 模拟比较器, 轨至轨输入输出, 微功率, 1, 20 µs, 1.7V 至 5.5V, NSOIC, 8 引脚
|
||
MAX965ESA+
|
Dallas Semiconductor | 完全替代 |
MAXIM INTEGRATED PRODUCTS MAX965ESA+ 模拟比较器, 轨至轨输入输出, 微功率, 1, 20 µs, 1.7V 至 5.5V, NSOIC, 8 引脚
|
|||
MAX965EUA+
|
Maxim Integrated | 完全替代 | TSSOP-8 |
MAXIM INTEGRATED PRODUCTS MAX965EUA+ 模拟比较器, 轨至轨输入输出, 微功率, 1, 20 µs, 1.8V 至 5.5V, µMAX, 8 引脚
|
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