Technical parameters/RAM size: | 240 x 8 |
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Encapsulation parameters/Encapsulation: | DIP-8 |
|
Dimensions/Packaging: | DIP-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MB95F212KPH-G-SNE2
|
Cypress Semiconductor | 功能相似 | DIP-8 |
MCU 8Bit F2MC F2MC-8FX CISC 4KB ROM 3.3V/5V 8Pin PDIP
|
||
MB95F212KPH-G-SNE2
|
Spansion | 功能相似 | DIP |
MCU 8Bit F2MC F2MC-8FX CISC 4KB ROM 3.3V/5V 8Pin PDIP
|
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