Technical parameters/RAM size: | 256 KB |
|
Technical parameters/operating temperature (Max): | 105 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Package parameters/number of pins: | 432 |
|
Encapsulation parameters/Encapsulation: | TFBGA-432 |
|
Dimensions/Packaging: | TFBGA-432 |
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Physical parameters/operating temperature: | -40℃ ~ 105℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MCIMX6L2EVN10AB
|
NXP | 完全替代 | BGA-432 |
NXP MCIMX6L2EVN10AB 芯片, 微处理器, CORTEX-A9, 32位, 1GHZ, MAPBGA-432
|
||
MCIMX6L2EVN10AB
|
NXP | 完全替代 | BGA-432 |
NXP MCIMX6L2EVN10AB 芯片, 微处理器, CORTEX-A9, 32位, 1GHZ, MAPBGA-432
|
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