Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM3495MTC/NOPB
|
National Semiconductor | 类似代替 | TSSOP-16 |
用于低输出电压的仿真峰值电流模式降压控制器 16-TSSOP -40 to 125
|
||
LM3495MTC/NOPB
|
TI | 类似代替 | TSSOP-16 |
用于低输出电压的仿真峰值电流模式降压控制器 16-TSSOP -40 to 125
|
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