Encapsulation parameters/Encapsulation: | BBGA-256 |
|
Dimensions/Packaging: | BBGA-256 |
|
Physical parameters/operating temperature: | -40℃ ~ 95℃ (TA) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC850DECVR50BU
|
NXP | 功能相似 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
||
|
|
Motorola | 功能相似 | 256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
||
MPC850DECVR50BU
|
Freescale | 功能相似 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review