Technical parameters/power supply voltage (DC): | 1.80 V |
|
Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/dissipated power: | 250 mW |
|
Technical parameters/kernel architecture: | PowerPC |
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Technical parameters/operating temperature (Max): | 95 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/dissipated power (Max): | 250 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 357 |
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Encapsulation parameters/Encapsulation: | BGA-357 |
|
Dimensions/Packaging: | BGA-357 |
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Physical parameters/operating temperature: | 0℃ ~ 95℃ (TA) |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC859TZP100A
|
Freescale | 完全替代 | PBGA-357 |
MPU MPC8xx RISC 32Bit 100MHz 3.3V 357Pin BGA Tray
|
||
MPC859TZP100A
|
NXP | 完全替代 | BBGA-357 |
MPU MPC8xx RISC 32Bit 100MHz 3.3V 357Pin BGA Tray
|
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