Chip AI consultant
Encapsulation parameters/Encapsulation: | LSSOP-16 |
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Dimensions/Packaging: | LSSOP-16 |
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Other/Series: | - |
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Other/Packaging: | Bulk |
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Other/Package Case: | 16-LSSOP (0.173", 4.40mm Width) |
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Other operating temperatures: | -20°C ~ 85°C |
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Other/Output Type: | Voltage - Buffered |
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Other Supplier Device Packages: | 16-LSSOP |
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Other/Data Interface: | SPI |
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Other/Number of Bits: | 12 |
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Other/Voltage Supply Analog: | 2.7 V ~ 3.6 V |
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Other/Voltage Supply Digital: | 2.7 V ~ 3.6 V |
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Other/Architecture: | R-2R |
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Other/Reference Type: | Supply |
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Other/Count-of-D-A-Converter: | 6 |
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Other/Settling Time: | 300μs |
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Other/Differential Output: | No |
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Other/INL-DNL-LSB: | ±1.5 (Max), ±1 (Max) |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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