Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCF8582C-2P
|
NXP | 功能相似 | DIP |
256到1024 ⅴ 8位CMOS EEPROM的具有I2C总线接口 256 to 1024 ⅴ 8-bit CMOS EEPROMs with I2C-bus interface
|
||
PCF8582C-2P/03,112
|
NXP | 功能相似 | DIP-8 |
NXP PCF8582C-2P/03,112 EEPROM, 2 Kbit, 256 x 8位, 100 kHz, I2C, DIP, 8 引脚
|
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