Technical parameters/power supply current: | 370 µA |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 3V ~ 4.5V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 130 |
|
Encapsulation parameters/Encapsulation: | BGA-130 |
|
Dimensions/Height: | 0.98 mm |
|
Dimensions/Packaging: | BGA-130 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Other/Manufacturing Applications: | processor |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC34709VK
|
Freescale | 完全替代 | MAPBGA-130 |
电源管理芯片, 4.5V电源, 5个DC-DC转换器, 8个LDO, 14稳压输出, MAPBGA-130
|
||
MC34709VK
|
NXP | 完全替代 | BGA-130 |
电源管理芯片, 4.5V电源, 5个DC-DC转换器, 8个LDO, 14稳压输出, MAPBGA-130
|
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