Technical parameters/number of contacts: | 25 |
|
Technical parameters/rated current: | 3 A |
|
Technical parameters/number of rows: | 2 |
|
Technical parameters/number of pins: | 25 |
|
Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Height: | 7.87 mm |
|
Physical parameters/contact material: | Copper Alloy |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MDM-25SCBR-A174
|
ITT Corporation | 类似代替 | Through Hole |
Conn Micro D-Subminiature SKT 25POS Solder RA Thru-Hole 25 Terminal 1Port
|
||
MDM-25SCBRP-A174
|
ITT Corporation | 类似代替 |
微-D印刷电路板 - .050触点间距 Micro-D PCB - .050 Contact Spacing
|
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