Encapsulation parameters/Encapsulation: | TFBGA |
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Dimensions/Packaging: | TFBGA |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ST Microelectronics | 功能相似 | TFBGA |
128兆, 256兆, 512兆, 1千兆( X8 / X16 ), 528字节/字264页, 1.8V / 3V , NAND闪存 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
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Micron | 功能相似 | BGA-55 |
128兆, 256兆, 512兆, 1千兆( X8 / X16 ), 528字节/字264页, 1.8V / 3V , NAND闪存 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
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Micron | 功能相似 | BGA |
SLC NAND Flash Parallel 3V/3.3V 256Mbit 32M x 8Bit 12us 55Pin VFBGA T/R
|
||
NAND256W3A2AZA6E
|
Micron | 功能相似 | BGA |
Flash, 32MX8, 35ns, PBGA55, VFBGA-55
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