Chip AI consultant
Technical parameters/power supply current: | 11 mA |
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Technical parameters/number of circuits: | 2 |
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Technical parameters/number of channels: | 2 |
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Technical parameters/Common Mode Rejection Ratio: | 75 dB |
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Technical parameters/input compensation drift: | 7.00 µV/K |
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Technical parameters/bandwidth: | 200 MHz |
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Technical parameters/conversion rate: | 335 V/μs |
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Technical parameters/gain bandwidth product: | 200 MHz |
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Technical parameters/input compensation voltage: | 1.5 mV |
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Technical parameters/input bias current: | 4 µA |
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Technical parameters/available channels: | D |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/3dB bandwidth: | 700 MHz |
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Technical parameters/Common Mode Rejection Ratio (Min): | 75 dB |
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Technical parameters/power supply voltage (Max): | 12 V |
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Technical parameters/power supply voltage (Min): | 6 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOT-23-8 |
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Dimensions/Length: | 2.9 mm |
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Dimensions/Width: | 1.63 mm |
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Dimensions/Height: | 1.1 mm |
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Dimensions/Packaging: | SOT-23-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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