Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOP |
|
Dimensions/Length: | 4.9 mm |
|
Dimensions/Width: | 3.9 mm |
|
Dimensions/Packaging: | SOP |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | SOIC |
Low Voltage, Rail-To-Rail Input and Output CMOS Operational Amplifier
|
||
|
|
TI | 功能相似 | SOP |
Low Voltage, Rail-To-Rail Input and Output CMOS Operational Amplifier
|
||
LMC6582AIMX
|
National Semiconductor | 功能相似 |
低电压轨至轨输入和输出CMOS运算放大器 Low Voltage, Rail-To-Rail Input and Output CMOS Operational Amplifier
|
|||
|
|
National Semiconductor | 功能相似 | SOIC |
运算放大器 LMC6582BIM SOIC-8
|
||
|
|
TI | 功能相似 | SOP |
运算放大器 LMC6582BIM SOIC-8
|
||
|
|
National | 功能相似 |
运算放大器 LMC6582BIM SOIC-8
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review