Technical parameters/rise/fall time: | 3.2µs, 4.7µs |
|
Technical parameters/Input voltage (DC): | 1.15 V |
|
Technical parameters/output voltage: | ≤70.0 V |
|
Technical parameters/number of circuits: | 1 |
|
Technical parameters/number of channels: | 1 |
|
Technical parameters/forward voltage: | 1.15 V |
|
Technical parameters/dissipated power: | 250 mW |
|
Technical parameters/rise time: | 3.20 µs |
|
Technical parameters/isolation voltage: | 2500 Vrms |
|
Technical parameters/forward current: | 60 mA |
|
Technical parameters/output voltage (Max): | 30 V |
|
Technical parameters/forward current (Max): | 60 mA |
|
Technical parameters/operating temperature (Max): | 100 ℃ |
|
Technical parameters/operating temperature (Min): | 40 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Length: | 5.13 mm |
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Dimensions/Width: | 4.16 mm |
|
Dimensions/Height: | 3.43 mm |
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Dimensions/Packaging: | SOIC-8 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
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