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Model MPC860SRCVR66D4
Description MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray
Product QR code
Brand: NXP
Packaging BGA-357
Delivery time
Packaging method Tray
Standard packaging quantity 1
726.45  yuan 726.45yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9605) Minimum order quantity(1)
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Technical parameters/power supply voltage (DC):

3.30 V

 

Technical parameters/halogen-free state:

Halogen Free

 

Technical parameters/digits:

32

 

Technical parameters/dissipated power:

762 mW

 

Technical parameters/kernel architecture:

PowerPC

 

Technical parameters/operating temperature (Max):

95 ℃

 

Technical parameters/operating temperature (Min):

-40 ℃

 

Technical parameters/dissipated power (Max):

762 mW

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

357

 

Encapsulation parameters/Encapsulation:

BGA-357

 

Dimensions/Packaging:

BGA-357

 

Physical parameters/operating temperature:

-40℃ ~ 95℃ (TA)

 

Other/Product Lifecycle:

Not Recommended for New Designs

 

Other/Packaging Methods:

Tray

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
MPC860ENCZQ66D4 MPC860ENCZQ66D4 Motorola 完全替代
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray
MPC860TCZQ66D4 MPC860TCZQ66D4 Motorola 完全替代 BGA
MPC8xx-微处理器-IC-series-1-코어-32-位-66MHz-357-PBGA（25x25）

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