Technical parameters/capacitance: | 15 pF |
|
Technical parameters/clamp voltage: | 10.5 V |
|
Technical parameters/peak pulse power: | 11 W |
|
Technical parameters/minimum reverse breakdown voltage: | 6 V |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
|
Encapsulation parameters/Encapsulation: | XFDFN-2 |
|
Dimensions/Height: | 0.31 mm |
|
Dimensions/Packaging: | XFDFN-2 |
|
Physical parameters/operating temperature: | -55℃ ~ 150℃ (TA) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Other/Manufacturing Applications: | General |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PESD5V0L1USF-H250,
|
NXP | 完全替代 | XFDFN-2 |
DIODE ESD PROT LOW CAP SOD962
|
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