Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | TSSOP |
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Dimensions/Packaging: | TSSOP |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 功能相似 | SOIC |
ON SEMICONDUCTOR MC100LVEP11DG 差分线路驱动器
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MC100LVEP11DR2G
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ON Semiconductor | 功能相似 | SOIC-8 |
2.5V / 3.3V ECL 1:2 差分 扇出缓冲器
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||
|
|
Freescale | 功能相似 | TSSOP |
ON SEMICONDUCTOR MC100LVEP11DTG DIFF FANOUT BUFFER, 1:2, TSSOP-8 新
|
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