Technical parameters/power supply current: | 150 nA |
|
Technical parameters/number of circuits: | 1 |
|
Technical parameters/dissipated power: | 250 mW |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/3dB bandwidth: | 60 MHz |
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Technical parameters/dissipated power (Max): | 250 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 6 |
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Encapsulation parameters/Encapsulation: | XFDFN-6 |
|
Dimensions/Packaging: | XFDFN-6 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NX3L1T3157GM,115
|
NXP | 功能相似 | XSON-6 |
NX3L1T3157 系列 单刀双掷 4.3 V 0.5 Ohm 表面贴装 模拟开关 - XSON-6
|
||
NX3L1T3157GW,125
|
NXP | 功能相似 | SC-88 |
SPST
|
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