Technical parameters/power supply voltage (DC): | 6.00 V |
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Technical parameters/output current: | 90mA @5V |
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Technical parameters/power supply current: | 9.6 mA |
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Technical parameters/number of circuits: | 2 |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/Common Mode Rejection Ratio: | 85 dB |
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Technical parameters/input compensation drift: | 5.00 µV/K |
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Technical parameters/bandwidth: | 400 MHz |
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Technical parameters/conversion rate: | 170 V/μs |
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Technical parameters/gain bandwidth product: | 240 MHz |
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Technical parameters/input compensation voltage: | 200 µV |
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Technical parameters/input bias current: | 9 µA |
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Technical parameters/available channels: | D |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/3dB bandwidth: | 400 MHz |
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Technical parameters/Common Mode Rejection Ratio (Min): | 85 dB |
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Technical parameters/power supply voltage: | 5V ~ 12V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: Alternative material
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