Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 48 |
|
Encapsulation parameters/Encapsulation: | TSOP |
|
Dimensions/Packaging: | TSOP |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TE28F800B3B90
|
Intel | 功能相似 |
SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32Mbit FLASH MEMORY FAMILY
|
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