Technical parameters/power supply current: | 180 mA |
|
Technical parameters/dissipated power: | 1839.4 W |
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Technical parameters/data rate: | 250 Mbps |
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Technical parameters/input current (Min): | 10 μA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 1839.4 mW |
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Technical parameters/power supply voltage: | 3V ~ 3.6V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 64 |
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Encapsulation parameters/Encapsulation: | TSSOP-64 |
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Dimensions/Height: | 1.05 mm |
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Dimensions/Packaging: | TSSOP-64 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65MLVD082DGG
|
TI | 完全替代 | TSSOP-64 |
TEXAS INSTRUMENTS SN65MLVD082DGG 芯片, 收发器, M-LVDS, 250MBPS, TSSOP-64
|
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