Technical parameters/rated voltage (DC): | 30 V |
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Technical parameters/rated voltage (AC): | 250 V |
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Technical parameters/Insulation resistance: | 1000 MΩ |
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Technical parameters/contact type: | DPDT |
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Technical parameters/inductance: | 3.00 H |
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Technical parameters/Contact resistance: | 30.0 mΩ |
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Technical parameters/power consumption: | 300 mW |
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Technical parameters/coil voltage: | 24 VDC |
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Technical parameters/coil current: | 12.5 mA |
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Technical parameters/coil power (DC): | 300 mW |
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Technical parameters/coil resistance: | 1.92 kΩ |
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Technical parameters/current carrying capacity: | 15.0 A |
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Technical parameters/coil voltage (DC): | 24 V |
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Technical parameters/coil power: | 300 mW |
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Technical parameters/rated power (Max): | 300W, 3.75KVA |
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Technical parameters/Switching current (Max): | 15 A |
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Technical parameters/operating temperature (Max): | 60 ℃ |
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Technical parameters/operating temperature (Min): | -50 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | Through Hole |
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Dimensions/Length: | 51 mm |
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Dimensions/Width: | 22 mm |
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Dimensions/Height: | 22 mm |
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Dimensions/Packaging: | Through Hole |
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Physical parameters/contact material: | Silver Tin Oxide |
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Physical parameters/operating temperature: | -50℃ ~ 60℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Box |
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Other/Manufacturing Applications: | Signal Processing, si Alternative material
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