Encapsulation parameters/Encapsulation: | DIP |
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Dimensions/Packaging: | DIP |
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Other/Product Lifecycle: | Obsolete |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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National Semiconductor | 功能相似 | DIP |
Progammable阵列逻辑系列24 ( PAL系列24 ) Progammable Array Logic Series 24 (PAL Series 24)
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National Semiconductor | 功能相似 | DIP |
Progammable阵列逻辑系列24 ( PAL系列24 ) Progammable Array Logic Series 24 (PAL Series 24)
|
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