Technical parameters/minimum current amplification factor (hFE): | 100 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/dissipated power (Max): | 750 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | TSOP |
|
Dimensions/Length: | 3.1 mm |
|
Dimensions/Width: | 1.7 mm |
|
Dimensions/Height: | 1 mm |
|
Dimensions/Packaging: | TSOP |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PBSS4350D,135
|
NXP | 类似代替 | SOT-457 |
TSOP NPN 50V 3A
|
||
PBSS4350D,135
|
Nexperia | 类似代替 | TSOP-6 |
TSOP NPN 50V 3A
|
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