Technical parameters/power supply current: | 31 mA |
|
Technical parameters/digits: | 16 |
|
Technical parameters/access time: | 105 ns |
|
Technical parameters/access time (Max): | 105 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 1.7V ~ 2V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 64 |
|
Encapsulation parameters/Encapsulation: | BGA-64 |
|
Dimensions/Packaging: | BGA-64 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
RC28F00BM29EWHA
|
Micron | 类似代替 | BGA-64 |
NOR Flash Parallel 3V/3.3V 2Gbit 256M/128M x 8Bit/16Bit 100ns 64Pin BGA Tray
|
||
S70GL02GS11FHI020
|
Spansion | 功能相似 | FBGA |
NOR Flash Parallel 3V/3.3V 2G-bit 256M x 8/128M x 16 110ns 64Pin FBGA Tray
|
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