Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 1608 |
|
Encapsulation parameters/Encapsulation: | 0603 |
|
Dimensions/Length: | 1.6 mm |
|
Dimensions/Width: | 0.8 mm |
|
Dimensions/Packaging (Metric): | 1608 |
|
Dimensions/Packaging: | 0603 |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
RP73D1J150KBTDG
|
TE Connectivity | 功能相似 | 0603 |
0603 150kΩ ±0.1% 0.1W(1/10W) ±15ppm/℃
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review