Technical parameters/power supply voltage (DC): | 3.30 V, 3.60 V (max) |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 209 |
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Encapsulation parameters/Encapsulation: | BGA-209 |
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Dimensions/Packaging: | BGA-209 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Not Recommended for New Designs |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | PCI To PCI Bridge |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCI2050GHK
|
TI | 类似代替 | BGA-209 |
PCI Bridge Chip 32Bit 66MHz 32Bit 209Pin BGA MICROSTAR Tray
|
||
PCI2050ZHK
|
TI | 类似代替 | BGA-209 |
PCI接口IC 32B 33 MHz PCI-to- PCI Bridge
|
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