Technical parameters/power supply current: | 660 mA |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 272 |
|
Encapsulation parameters/Encapsulation: | BGA-272 |
|
Dimensions/Width: | 27 mm |
|
Dimensions/Packaging: | BGA-272 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tube |
|
Other/Manufacturing Applications: | PCI To PCI Bridge |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCI2050APDV
|
TI | 功能相似 | LQFP-208 |
PCI/PCIE接口 PCI2050APDV LQFP-32(7x7)
|
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