Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 165 |
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Encapsulation parameters/Encapsulation: | FBGA |
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Dimensions/Packaging: | FBGA |
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Other/Memory configurations: | 1M×36 |
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Other/Speed: | 3.3ns |
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Other/Power supply voltage: | 1.8±0.1V |
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Other/Package: | FBGA |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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