Technical parameters/power supply voltage (DC): | 5.00 V, 5.50 V (max) |
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Technical parameters/clock frequency: | 20.0MHz (max) |
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Technical parameters/RAM size: | 128 B |
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Technical parameters/digits: | 8 |
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Technical parameters/dissipated power: | 1000 mW |
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Technical parameters/I/O pin count: | 16 |
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Technical parameters/access time: | 20.0 µs |
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Technical parameters/kernel architecture: | PIC |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Technical parameters/Digital to Analog Conversion (DAC): | 1 |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 4 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 20 |
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Encapsulation parameters/Encapsulation: | SOIC-20 |
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Dimensions/Length: | 12.8 mm |
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Dimensions/Width: | 7.49 mm |
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Dimensions/Height: | 2.31 mm |
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Dimensions/Packaging: | SOIC-20 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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