Technical parameters/power supply voltage (DC): | 5.00 V, 5.50 V (max) |
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Technical parameters/clock frequency: | 20.0 MHz |
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Technical parameters/RAM size: | 224 B |
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Technical parameters/digits: | 8 |
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Technical parameters/dissipated power: | 800 mW |
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Technical parameters/FLASH memory capacity: | 1.75 KB |
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Technical parameters/I/O pin count: | 16 |
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Technical parameters/access time: | 20.0 µs |
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Technical parameters/kernel architecture: | PIC |
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Technical parameters/memory capacity: | 1000 B |
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Technical parameters/internal nuclear architecture: | PIC16 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 800 mW |
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Technical parameters/power supply voltage: | 3V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 18 |
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Encapsulation parameters/Encapsulation: | SOIC-18 |
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Dimensions/Packaging: | SOIC-18 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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Customs information/ECCN code: | EAR99 |
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