Technical parameters/RAM size: | 368 b |
|
Technical parameters/dissipated power: | 800 mW |
|
Technical parameters/dissipated power (Max): | 800 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 28 |
|
Encapsulation parameters/Encapsulation: | QFN-28 |
|
Dimensions/Packaging: | QFN-28 |
|
Physical parameters/operating temperature: | -40℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC16F886-I/SO
|
Microchip | 完全替代 | SOIC-28 |
MICROCHIP PIC16F886-I/SO 微控制器, 8位, 闪存, AEC-Q100, PIC16F, 20 MHz, 14 KB, 368 Byte, 28 引脚, SOIC
|
||
PIC16F886-I/SP
|
Micrel | 完全替代 |
MICROCHIP PIC16F886-I/SP 微控制器, 8位, 闪存, AEC-Q100, PIC16F, 20 MHz, 14 KB, 368 Byte, 28 引脚, DIP
|
|||
PIC16F886-I/SP
|
Microchip | 完全替代 | DIP-28 |
MICROCHIP PIC16F886-I/SP 微控制器, 8位, 闪存, AEC-Q100, PIC16F, 20 MHz, 14 KB, 368 Byte, 28 引脚, DIP
|
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