Technical parameters/RAM size: | 256 x 8 |
|
Technical parameters/dissipated power: | 1000 mW |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | QFN-28 |
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Dimensions/Packaging: | QFN-28 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC18F1330-I/ML
|
Microchip | 类似代替 | QFN-28 |
18 /20/ 28引脚,增强型闪存微控制器采用纳瓦技术,高性能PWM和A / D 18/20/28-Pin, Enhanced Flash Microcontrollers with nanoWatt Technology, High-Performance PWM and A/D
|
||
PIC18F1330-I/ML
|
Micrel | 类似代替 |
18 /20/ 28引脚,增强型闪存微控制器采用纳瓦技术,高性能PWM和A / D 18/20/28-Pin, Enhanced Flash Microcontrollers with nanoWatt Technology, High-Performance PWM and A/D
|
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