Technical parameters/number of contacts: | 1 |
|
Technical parameters/polarity: | Male |
|
Technical parameters/Contact electroplating: | Gold over Nickel, Gold |
|
Technical parameters/rated voltage (DC): | 1.50 kV |
|
Technical parameters/rated current: | 3.00 A |
|
Technical parameters/Insulation resistance: | 5000 MΩ |
|
Technical parameters/number of rows: | 1 |
|
Technical parameters/Flammability level: | UL 94 V-0 |
|
Technical parameters/number of pins: | 36 |
|
Technical parameters/rated current (Max): | 3A/contact |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/rated voltage (Max): | 1500 VAC |
|
Encapsulation parameters/installation method: | Through Hole |
|
Packaging parameters/pin spacing: | 2.54 mm |
|
Dimensions/Height: | 8.38 mm |
|
Dimensions/Pin Spacing: | 2.54 mm |
|
Physical parameters/shell color: | Black |
|
Physical parameters/color: | Black |
|
Physical parameters/contact material: | Phosphor Bronze |
|
Physical parameters/operating temperature: | -65℃ ~ 125℃ |
|
Physical parameters/shell material: | Nylon |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Other/Manufacturing Applications: | - |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Amphenol ICC | 类似代替 |
集管和线壳 .100CC STR HEADER
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67997-200HLF
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FCI Electronics | 类似代替 |
集管和线壳 .100CC STR HEADER
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67997-200HLF
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Amphenol | 类似代替 | - |
集管和线壳 .100CC STR HEADER
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||
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Amphenol ICC | 类似代替 |
Conn Unshrouded Header HDR 1POS Solder ST Thru-Hole Bag
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68001-400HLF
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Future Communications IC | 类似代替 |
Conn Unshrouded Header HDR 1POS Solder ST Thru-Hole Bag
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68001-400HLF
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FCI Electronics | 类似代替 |
Conn Unshrouded Header HDR 1POS Solder ST Thru-Hole Bag
|
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